Last edited by Nahn
Sunday, July 19, 2020 | History

4 edition of Electronic packaging materials science VI found in the catalog.

Electronic packaging materials science VI

symposiumheld April 27-30, 1992, San Francisco, California, U.S.A.

  • 159 Want to read
  • 6 Currently reading

Published by Materials Research Society in Pittsburgh, Pa .
Written in English

    Subjects:
  • Electronic packaging -- Congresses.,
  • Electronic packaging -- Materials -- Congresses.

  • Edition Notes

    Includes bibliographical references and indexes.

    Statementeditors, Paul S. Ho ... (et al.)..
    SeriesMaterials Research Society symposium proceedings -- v.264, Materials Research Society symposia proceedings -- v.264.
    ContributionsHo, P. S., Materials Research Society., Symposium on Electronic Packaging Materials Science (1992 : San Francisco, Calif.)
    Classifications
    LC ClassificationsTK7870.15
    The Physical Object
    Pagination439 p. :
    Number of Pages439
    ID Numbers
    Open LibraryOL21934189M
    ISBN 101558991697

    This is an authoritative reference source of practical information on the materials and processes of microelectronic packaging. Its articles offer the collective knowledge, wisdom, and judgment of expert microelectronics packaging authors, co-authors, and reviewers. The big book of packaging is to make your life simple and less complicated. Once you read this book, it will get you going and help you to survive at your own. We have tried to cover all the relevant topics of packaging that needs our attention almost everyday.

    The Conference on Manufacturing Engineering and Process is an annual international event to ensure interaction between scientists, engineers and also the dissemination of research results related to the materials science and modern materials synthesis and processing technologies. The 7th International Conference on Manufacturing Engineering and Process (ICMEP ) was held on February Aug 19,  · This book covers recent advancements in the field of polymer science and technology. Frontiers areas, such as polymers based on bio-sources, polymer based ferroelectrics, polymer nanocomposites for capacitors, food packaging and electronic packaging, piezoelectric sensors, polymers from renewable resources, superhydrophobic materials and electrospinning are topics of brightsideglobaltrade.com Edition: 1st Edition.

    Mar 06,  · K. N. Subramanian is Professor of Materials Science and Engineering at Michigan State University. He has been a full-time faculty member at MSU for over 45 years. For the last 15 years he has devoted all his research efforts to lead-free electronic solders. This book covers recent advancements in the field of polymer science and technology. Frontiers areas, such as polymers based on bio-sources, polymer based ferroelectrics, polymer nanocomposites for capacitors, food packaging and electronic packaging, piezoelectric sensors, polymers from renewable resources, superhydrophobic materials and electrospinning are topics of discussion.


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Volume 1: Packaging is an authoritative reference source of practical information for the design or process engineer who must make informed day-to-day decisions about the materials and processes of microelectronic packaging. Its articles offer the collective knowledge, wisdom, and judgement of microelectronics packaging experts-authors, co-authors, and reviewers-representing /5(4).

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are products of materials science and technology (MST). Briefly defined, materials science is the study of “stuff.” Materials science is the study of solid matter, inorganic and organic. Figures,and depict how these materials are classified.

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